Performance

1) Ceramic package suitable for high-frequency wired and wireless communications package
2) High electrical insulation
3) Low properties degradation caused by high frequency
4) High-temperature heat resistance
5) Low electrical resistance
6) High thermal conductivity due to Heat Sink
7) Excellent soldering properties

Size/Standard

6.35mm X 6.35mm

Key Features

Package thickness： 0.61 mm
1) Ceramic material： MDT-AHTCC， 90％ Black alumina.
2) Metallization： W(Tungsten)
3) Number of layers： 1 layer
4) Ring for sealing： Kovar
5) Lead frame： Kovar or Alloy42
6) Electroplating thickness： Ni 1.3~8.9㎛， Au≥2.5㎛