Performance

1) Ceramic package suitable for high-frequency wired and wireless communications package
2) High electrical insulation
3) Low properties degradation caused by high frequency
4) High-temperature heat resistance
5) Low electrical resistance
6) High thermal conductivity due to Heat Sink
7) Excellent soldering properties

Size/Standard

12.95mm X 9.78mm

Key Features

1) Package thickness： 0.64 mm
2) Ceramic material： MDT-AHTCC， 90％ Black alumina.
3) Metallization： W(Tungsten)
4) Number of layers： 1 layer
5) Ring for sealing： Kovar
6) Lead frame： Metallization or Alloy42
7) Electroplating thickness： Ni 1.3~8.9㎛， Au≥2.5㎛