Performance
1) Suitable for sensor packages with excellent modulus of electricity (~350GPA) and low coefficient of thermal expansion (5~6 x 10-5</sup>/℃)
2) Properties of sensor products, package camber to improve wire bonding properties, Improvement of diagonal dispersion.
3) High strength, high thermal conductivity
4) High precision flat cavity structure
Size/Standard
14.22mm X 14.22mm
Key Features
1) Package thickness: 1.92mm
2) Ceramic material: MDT-AHTCC, 90% Black alumina.
3) Materialization: W(Tungsten)
4) Amount of array: 16ea
5) Number of layer: 4 layers
6) Electroplating thickness: Ni 1.3~8.9㎛, Au≥0.3㎛