Performance

1) Suitable for sensor packages with excellent modulus of electricity (~350GPA) and low coefficient of thermal expansion (5~6 x 10^{-5<／sup>／℃)
2) Excellent electrical insulating properties (1010<／sup>Ω above)， High-temperature heat resistance， high durability， high fatigue resistance， and high W：L ratio product (1：4~5)}

Size/Standard

19.20mm X 7.3mm

Key Features

1) Package thickness： 4.30mm
2) Ceramic material： MDT-AHTCC， 90％ Black alumina.
3) Materialization： W(Tungsten)
4) Arrays： 27ea
5) Number of layers： 9 layers
6) Ring for sealing： Kovar
7) Lead frame： Kovar or Alloy42
8) Electroplating thickness： Ni 1.3~8.9㎛， Au≥1.3㎛