Performance
1) Suitable for sensor packages with excellent modulus of electricity (~350GPA) and low coefficient of thermal expansion (5~6 x 10-5</sup>/℃)
2) Excellent electrical insulating properties (1010</sup>Ω above), High-temperature heat resistance, high durability, high fatigue resistance
Size/Standard
18.45mm X 7.5mm
Key Features
1) Package thickness: 1.95mm
2) Ceramic material: MDT-AHTCC, 90% Black alumina.
3) Materialization: W(Tungsten)
4) Arrays: 25ea
5) Number of layers: 6 layers
6) Lead frame: Kovar or Alloy42
7) Electroplating thickness: Ni 1.3~8.9㎛, Au≥1.3㎛