Performance

1) Suitable for sensor packages with excellent modulus of electricity (~350GPA) and low coefficient of thermal expansion (5~6 x 10^{-5<／sup>／℃)
2) Excellent electrical insulating properties (1010<／sup>Ω above)， High-temperature heat resistance， high durability， high fatigue resistance}

Size/Standard

15.45mm X 7.5mm

Key Features

1) Package thickness： 1.56mm
2) Ceramic material： MDT-AHTCC，90％ Black alumina.
3) Materialization： W(Tungsten)
4) Arrays： 32ea
5) Number of layers： 4 layers
6) Ring for sealing： Kovar
7) Lead frame： Kovar or Alloy42
8) Electroplating thickness： Ni 1.3~8.9㎛， Au≥1.3㎛