Performance
1) Suitable for sensor packages with excellent modulus of electricity (~350GPA) and low coefficient of thermal expansion (5~6 x 10-5</sup>/℃)
2) Properties of sensor products, package camber to improve wire bonding properties, Improvement of diagonal dispersion.
Size/Standard
Ф8.80mm
Key Features
1) Package thickness: 0.38mm
2) Ceramic material: MDT-AHTCC, 90% Black alumina.
3) Materialization: W(Tungsten)
4) Arrays: 10ea
5) Number of layers: 1 layer
6) Electroplating thickness: Ni 1.3~8.9㎛, Au≥0.3㎛