Performance

1) Suitable for sensor packages with excellent modulus of electricity (~350GPA) and low coefficient of thermal expansion (5~6 x 10^{-5<／sup>／℃)
3) Properties of sensor products， a package camber to improve wire bonding properties， Improvement of diagonal dispersion.
4) High strength， high thermal conductivity
5) High precision flat cavity structure}

Size/Standard

11.85mm X 11.85mm

Key Features

1) Package thickness： 1.60mm
2) Ceramic material： MDT-AHTCC， 90％ Black alumina.
3) Materialization： W(Tungsten)
4) Arrays： 25ea
5) Number of layers： 4 layers
6) Electroplating thickness： Ni 1.3~8.9㎛， Au≥0.3㎛